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Browse Prior Art Database

Metal Inlays

IP.com Disclosure Number: IPCOM000095784D
Original Publication Date: 1964-Jun-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Kurtz, FJ: AUTHOR

Abstract

When metal inlays are to be employed as connection lands in substrates for deposited electrical circuitry, a smooth transition from the surface of the substrate to the surface of the land is required. The penumbra effect, which occurs when material is vacuum deposited through a mask, can be utilized to provide feathered edges in the land for yielding the desired smooth transition.

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Metal Inlays

When metal inlays are to be employed as connection lands in substrates for deposited electrical circuitry, a smooth transition from the surface of the substrate to the surface of the land is required. The penumbra effect, which occurs when material is vacuum deposited through a mask, can be utilized to provide feathered edges in the land for yielding the desired smooth transition.

A suitable mold release coating is applied to the face of a temporary substrate 10. Using a vacuum chamber 12, an evaporant metal source 14, and a mask 16, the land 18 is deposited on the substrate 10 over the mold release film. The penumbra effect of vapor rays 20 and 22 feathers the edges 24 and 26 of the deposit. The deposit thickness and the penumbra effect are shown exaggerated for clarity.

The temporary substrate 10 is then utilized as a face plate in a mold 27, the land 18 bearing side facing the mold cavity. A suitable plastic 28 is cast against it and cured in a conventional manner. The plastic material 28 becomes the permanent substrate. When it is removed from the mold, the metal land 18 is transferred from the temporary substrate 10 and remains imbedded in the surface of substrate 28.

Since the feathered edges 24 and 26 taper to virtually mono-atomic thickness, the transition from the land to the surface of the substrate 28 is smooth and tends to be crack-free even when subjected to thermal stresses.

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