Browse Prior Art Database

Heat Conducting Vibration and Shock Mount

IP.com Disclosure Number: IPCOM000095785D
Original Publication Date: 1964-Jun-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Panero, MC: AUTHOR

Abstract

The device is a special packaging member for use with an electronic circuit board. The member provides both cooling of the board by thermal conduction to a heat sink as well as isolation from external mechanical shocks and vibrations.

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Heat Conducting Vibration and Shock Mount

The device is a special packaging member for use with an electronic circuit board. The member provides both cooling of the board by thermal conduction to a heat sink as well as isolation from external mechanical shocks and vibrations.

A wire mesh is looped around the edge of the board and secured to metal lands on the margins by soldering, for example. The space at the edge of the board enclosed by the mesh is filled with a resilient material having good shock and vibration absorption properties, such as sponge rubber.

In mounted condition, the wire mesh compressively contacts a mounting frame that also serves as a heat sink, shown in generalized form. Heat generated in the circuit board is conducted to the heat sink via the mesh. The resilient material simultaneously provides the desired mechanical energy isolation.

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