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Electroless Plated Tape having Improved Conformation and Crack Resistance

IP.com Disclosure Number: IPCOM000095825D
Original Publication Date: 1964-Aug-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Judge, JS: AUTHOR [+2]

Abstract

Magnetic tape cupping, a cause of trouble in tape transport head to tape spacing, is substantially eliminated by maintaining the tape under tension in the longitudinal direction during the coating step.

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Electroless Plated Tape having Improved Conformation and Crack Resistance

Magnetic tape cupping, a cause of trouble in tape transport head to tape spacing, is substantially eliminated by maintaining the tape under tension in the longitudinal direction during the coating step.

Maintaining a tape substrate composed of material such as polyethylene terephthalate under tension perpendicular to the width during electroless plating produces a plated tape with improved conformation. Longitudinal tension of about 2 lbs./in. or more substantially eliminates residual stress in the width-wise direction of the tape. Residual stress is the major cause of tape cupping. Its elimination reduces the tendency of plated tape to cup and subsequently decreases tape transport head spacing problems.

An additional benefit is obtained by coating the tape while maintaining it under longitudinal stress. When the tension is released, the coating has a higher than normal degree of compression in the longitudinal direction. This results in increased coating tensile strength so that the coating is less likely to crack when stretched during use.

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