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Producing Insulating Layers on Printed Circuit Boards

IP.com Disclosure Number: IPCOM000095870D
Original Publication Date: 1964-Aug-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lenoble, JP: AUTHOR [+2]

Abstract

An insulating layer is produced on a printed circuit board by placing shims on the board to define the edges of the area to be coated. Then, a liquid insulant, such as an epoxy resin, is poured onto the surface of the board between the shims. Next a sheet of flexible material, such as MELINEX*, which does not adhere to the insulant is rolled flat over the liquid and shims using the shims as the supports for the rolling action.

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Producing Insulating Layers on Printed Circuit Boards

An insulating layer is produced on a printed circuit board by placing shims on the board to define the edges of the area to be coated. Then, a liquid insulant, such as an epoxy resin, is poured onto the surface of the board between the shims. Next a sheet of flexible material, such as MELINEX*, which does not adhere to the insulant is rolled flat over the liquid and shims using the shims as the supports for the rolling action.

The sheet and board are then pressed between flat plates and the insulant is cured with the plates in position. The board and sheet are then extracted from the plates and the sheet and shims are removed from the board. *MELINEX is a trademark of Imperial Chemical Industries, Ltd.

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