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Sputtering from Powdered Mixtures

IP.com Disclosure Number: IPCOM000095878D
Original Publication Date: 1964-Aug-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hallen, RL: AUTHOR [+2]

Abstract

A cathode for the deposition of films by cathodic sputtering can be formed from fine particles. As one alternate, the particles are firmly pressed into a container having an electrical contact to the particles to form the cathode. A second alternate is to sinter the particles in a suitable container under a pressure of about 1000 p. s. i. and an elevated temperature to form the cathode.

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Sputtering from Powdered Mixtures

A cathode for the deposition of films by cathodic sputtering can be formed from fine particles. As one alternate, the particles are firmly pressed into a container having an electrical contact to the particles to form the cathode. A second alternate is to sinter the particles in a suitable container under a pressure of about 1000 p. s. i. and an elevated temperature to form the cathode.

The particles used can be composed of a single element or an alloy, or an intimate mixture of particles of a plurality of elements or alloys. Either normal or reactive sputtering can be used. Silicon substrates are coated with a closely controlled glass composition by oxygen reactive sputtering a cathode made from pressed particles of highly-pure elemental silicon, boron and aluminum.

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