Browse Prior Art Database

Multilayer Circuit Board

IP.com Disclosure Number: IPCOM000095892D
Original Publication Date: 1964-Sep-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Allen, LJ: AUTHOR

Abstract

This multilayer circuit board 11 is constructed by laminating thin circuit strips 13 perpendicular to the usual horizontal plane into a top board 15 and a bottom board 17 having circuits 19 and 21 in vertical planes.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Multilayer Circuit Board

This multilayer circuit board 11 is constructed by laminating thin circuit strips 13 perpendicular to the usual horizontal plane into a top board 15 and a bottom board 17 having circuits 19 and 21 in vertical planes.

The boards are arranged with the strips in perpendicular vertical connections
25. Upper circuits are connected at 27 to lower circuits. This arrangement replaces plated through hole constructions which require more space.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]