Browse Prior Art Database

Through Hold Connector

IP.com Disclosure Number: IPCOM000095914D
Original Publication Date: 1964-Sep-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Coughlin, CP: AUTHOR [+2]

Abstract

This through hold connector is fabricated by conventional silk screen processes and apparatus. The connector employs commercially available materials and is especially suitable for ceramic substrates.

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Through Hold Connector

This through hold connector is fabricated by conventional silk screen processes and apparatus. The connector employs commercially available materials and is especially suitable for ceramic substrates.

Ceramic wafer 10 has a plurality of apertures 12 about its periphery. Each aperture 12 is loaded with a solderable paste 14. The paste is one of several commercially available, e. g., gold-platinum or silver-palladium. The paste is loaded by well-known screen techniques or like processes. Alternatively, apertures 12 are filled by applying the paste with an extrusion printing apparatus,
e. g., that described in the IBM Technical Disclosure Bulletin, September 1963, Volume 6, No. 4, page 76. An extrusion pressure of 20 PSI for 0.3 seconds or
3.5 PSI for 0.7 seconds with a paste viscosity of 33 to 40 units on the rotoviscometer is satisfactory.

The apertures are subjected to air pressure, approximately 20 PSI for one second. The paste is driven through each aperture and coats the surface. A uniform film of paste is present on the surface wall of the aperture. The wafer is fired for twenty minutes at 760 Degrees C to form a metallic surface within the aperture. A good through hole connection is completed by dipping the wafer in 90/10 solder or like.

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