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Electrical Grounding Arrangement

IP.com Disclosure Number: IPCOM000095979D
Original Publication Date: 1964-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Smith, JF: AUTHOR

Abstract

This electrical grounding arrangement is used for a circuit card 10 supported within an electrically conductive guide rail 12. Drawings A, B, and C are, respectively, top plan, front elevation, and cross-sectional views. Drawing C is a view taken along line C-C of B.

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Electrical Grounding Arrangement

This electrical grounding arrangement is used for a circuit card 10 supported within an electrically conductive guide rail 12. Drawings A, B, and C are, respectively, top plan, front elevation, and cross-sectional views. Drawing C is a view taken along line C-C of B.

The arrangement utilizes an electrically conductive strip 14 to form an electrical spring contact within relatively wide slot 16 in guide rail 12. Circuit card 10 can be made of, e. g., a plastic base 18 having a copper film or layer 20 on each side of it. Strip 14, which can be made of phosphor bronze, is woven into card 10 through uniformly spaced slots or apertures 22. The ends or terminals 24 are soldered to layer 20. Fixing the strip 14 at each end provides tension for the points of contact between the strip 14 and guide rail 12. The tension at these points of contact can be changed by using different thicknesses of strip 14.

A highly conductive path is realized from layer 20 to guide rail 12 through strip 14. Strip 14 may act as a high inductance for high frequency pulse rates which may be overcome by the capacitance produced by an edge 26 of card 10 disposed within a relatively narrow slot 28 in guide rail 12 forming a parallel resonant circuit for the high frequencies.

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