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Interconnection Means for Circuit Modules

IP.com Disclosure Number: IPCOM000096013D
Original Publication Date: 1964-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 68K

Publishing Venue

IBM

Related People

Feth, GC: AUTHOR

Abstract

This is a method for forming an interconnection structure for circuit modules. Dielectric sheet 1, having a plurality of parallel thin film conductors 3 formed on it, is positioned and pressed between die members 5 and 7 as shown in A. When sheet 1 is pressed, upper die member 7 is removed. Grooves formed in sheet 1 are filled with an adherent dielectric material 9 as in drawing B. A first pressed dielectric sheet 1' is mounted onto board 1 1 to give it mechanical rigidity.

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Interconnection Means for Circuit Modules

This is a method for forming an interconnection structure for circuit modules. Dielectric sheet 1, having a plurality of parallel thin film conductors 3 formed on it, is positioned and pressed between die members 5 and 7 as shown in A. When sheet 1 is pressed, upper die member 7 is removed. Grooves formed in sheet 1 are filled with an adherent dielectric material 9 as in drawing B. A first pressed dielectric sheet 1' is mounted onto board 1 1 to give it mechanical rigidity.

The resulting structure has a plurality of raised parallel surfaces 13 and a plurality of parallel conductors 3 running transverse to them. A second pressed dielectric sheet 1'' is cut into strips and fitted between the raised surfaces 13 as shown in C so as to form a two-dimensional wiring array defining a plurality of recesses 15.

Before adhering sheets 1 to board 11, conductors 3 on sheets 1I and 1'' can be tailored to form desired interconnection patterns by cutting conductors 3 at appropriate points indicated as 17. Also, interconnection between conductors 3 can be effected by passing pins 19 through the intervening sheet 1''.

Circuit modules, i. e., semiconductor wafers carrying conductors and circuit elements, can be inserted into recesses 15. Connections can be made between them by thermal compression bonding of small conducting jumpers on appropriate conductors 3 on raised surfaces 13.

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