Browse Prior Art Database

High Density Module

IP.com Disclosure Number: IPCOM000096037D
Original Publication Date: 1964-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Shepheard, RG: AUTHOR [+2]

Abstract

The stacked module 10 includes a pair of individual module substrates 11 and 12. Each of these has various devices and circuitry mounted on both its top and bottom sides. Substrates 11 and 12 are electrically interconnected by a plurality of pins 13 and bear active devices 14 such as transistors and diodes. These are mounted by placing, e. g., the emitter and base contacts on the top side of substrate 12 and the collector contact on the bottom of substrate 11. In mounting active device 14 onto emitter and base contacts 15 and 16 and collector contact 17, solder is applied over the emitter, base and collector contacts on their respective substrates. Active device 14 is placed on the emitter and base contacts. Substrate 1 1 is then placed upon active device 14.

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High Density Module

The stacked module 10 includes a pair of individual module substrates 11 and 12. Each of these has various devices and circuitry mounted on both its top and bottom sides. Substrates 11 and 12 are electrically interconnected by a plurality of pins 13 and bear active devices 14 such as transistors and diodes. These are mounted by placing, e. g., the emitter and base contacts on the top side of substrate 12 and the collector contact on the bottom of substrate 11. In mounting active device 14 onto emitter and base contacts 15 and 16 and collector contact 17, solder is applied over the emitter, base and collector contacts on their respective substrates. Active device 14 is placed on the emitter and base contacts. Substrate 1 1 is then placed upon active device 14.

The stacked module is heated in the furnace to fully fix active device 14 on its contacts. Jumper solder connections 18 can be made between the two substrates 1 1 and 12 by a similar technique of applying solder to both the top surface of substrate 12 and the bottom surface of substrate 11 and forcing the two together.

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