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Printed Circuit Board Hole Addition

IP.com Disclosure Number: IPCOM000096040D
Original Publication Date: 1964-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Byrnes, HP: AUTHOR [+2]

Abstract

This connection arrangement permits module pin connection to, or insulation from, a printed circuit board and provides for subsequent circuit additions. A copper sleeve 1 1 is coated with TEF/LON* and placed in a plated through hole 15 of a printed circuit board 17.

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Printed Circuit Board Hole Addition

This connection arrangement permits module pin connection to, or insulation from, a printed circuit board and provides for subsequent circuit additions. A copper sleeve 1 1 is coated with TEF/LON* and placed in a plated through hole 15 of a printed circuit board 17.

The top end is flanged to an entrance for module pins. Connections to the plated through hole is obtained by solder bridging at the indicated locations. Other connections are made by using the outer copper coating 19 at the bottom of the connector. *TEF/LON is a trademark of E. I. Du Pont de Nemours and Co.

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