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Browse Prior Art Database

Module Package

IP.com Disclosure Number: IPCOM000096072D
Original Publication Date: 1964-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Dion, RR: AUTHOR [+2]

Abstract

Active and passive electrical components mounted upon ceramic substrate 1 are protected from humidity or other environmental conditions by soft, flexible coating 2. Transfer molded epoxy resin shell 3 is formed entirely around substrate 1 and coating 2 to complete the module package.

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Module Package

Active and passive electrical components mounted upon ceramic substrate 1 are protected from humidity or other environmental conditions by soft, flexible coating 2. Transfer molded epoxy resin shell 3 is formed entirely around substrate 1 and coating 2 to complete the module package.

Epoxy shell 3 provides mechanical protection and solvent resistance for the package. The preferred flexible coating is a cured silicone rubber.

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