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Process for Selectively Etching a Copper Laminate

IP.com Disclosure Number: IPCOM000096074D
Original Publication Date: 1964-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cantin, G: AUTHOR [+2]

Abstract

To etch a desired pattern, e.g., a circuit, into a copper laminate, the following steps are performed: 1. Clean surface with a standard commercial copper cleaner. 2. Rinse. 3. Dip surface in the aqueous solution FeCl(3) x 6 H(2)O for approximately ten seconds. 4. Rinse. 5. Air dry and bake. 6. Coat surface with a photoresist such as KPR*. 7. Air dry and bake. 8. Expose in a conventional manner to desired pattern. 9. Inspect the pattern for flaws. 10. Develop in a conventional manner to remove photoresist from unexposed areas. 11. Etch.

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Process for Selectively Etching a Copper Laminate

To etch a desired pattern, e.g., a circuit, into a copper laminate, the following steps are performed:
1. Clean surface with a standard commercial copper cleaner.
2. Rinse.
3. Dip surface in the aqueous solution FeCl(3) x 6 H(2)O for

approximately ten seconds.
4. Rinse.
5. Air dry and bake.
6. Coat surface with a photoresist such as KPR*.
7. Air dry and bake.
8. Expose in a conventional manner to desired pattern.
9. Inspect the pattern for flaws.
10. Develop in a conventional manner to remove photoresist from

unexposed areas.
11. Etch.

The exposure step itself produces a visible image of the pattern upon the surface, therefore permitting inspection prior to the developing step. Where a dilute HCl solution is used instead of FeCl(3) x 6 H(2)0, the exposed photoresist has to be developed and dipped in a dye solution before the circuit pattern can be inspected. This process, therefore, eliminates the dyeing step and further alleviates the need for developing circuits having flaws. CuCl(3) can be employed in place of FeCl(3). *KPR is a trademark of Eastman Kodak Company.

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