Browse Prior Art Database

Electrical Grounding of Magnetic Head Assembly

IP.com Disclosure Number: IPCOM000096119D
Original Publication Date: 1964-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Bradford, RC: AUTHOR [+2]

Abstract

This magnetic head structure has provision for effective electrical grounding of core elements and shields. The grounding is necessary in heads that operate at high frequencies to reduce cross talk between read cores and feedthrough noise in two gap read-write heads.

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Electrical Grounding of Magnetic Head Assembly

This magnetic head structure has provision for effective electrical grounding of core elements and shields. The grounding is necessary in heads that operate at high frequencies to reduce cross talk between read cores and feedthrough noise in two gap read-write heads.

In portion 1 of a multitrack head assembly, alternate core 2 and shield 3 elements are held in housing 4 by epoxy 5. Surface 6 of the head assembly that touches the housing and a part of all the core and shield elements is ground clean. Area 7, including surface 6, is filled with a conductive epoxy to insure an effective ground connection between the core and shield elements and the housing.

An alternate arrangement for grounding the elements provides for electroplating a conductive material, such as copper, to an area of the head which is connected to all of the elements of the assembly.

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