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Improved Platinum Electrodes

IP.com Disclosure Number: IPCOM000096128D
Original Publication Date: 1964-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Miller, LF: AUTHOR

Abstract

Platinum is a preferred material in electrode pastes for, among other reasons, platinum does not migrate to form dendrites when placed under electric field. However, platinum is an expensive metal and, furthermore, does not readily lend itself to lead-tin soldering. Such disadvantages can be overcome by the addition of silver providing the percentage of silver added to the paste is not so large as to result in the occurrence of silver migration.

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Improved Platinum Electrodes

Platinum is a preferred material in electrode pastes for, among other reasons, platinum does not migrate to form dendrites when placed under electric field. However, platinum is an expensive metal and, furthermore, does not readily lend itself to lead-tin soldering. Such disadvantages can be overcome by the addition of silver providing the percentage of silver added to the paste is not so large as to result in the occurrence of silver migration.

Small amounts of silver can be added to the electrode paste by first chemically depositing silver onto the surfaces of the platinum particles which are then mixed with the paste. The particular chemical deposition can be from an aqueous silver nitrate solution by reduction of silver by such agents as hydrazine or hydrogen gas. An electrode formed by this process is readily solderable. It, furthermore, has no apparent interaction with, among other things, a glazed resistor to which the electrode is attached. With this process, there may be maintained a ratio of one part or less of silver to three parts of platinum.

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