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Browse Prior Art Database

Matrix Electropolishing and Plating Apparatus

IP.com Disclosure Number: IPCOM000096136D
Original Publication Date: 1963-Jan-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Langley, RF: AUTHOR

Abstract

The nonuniformity of material removal or plating experienced when concurrently treating a plurality of parts in an electrolyte bath is overcome by surrounding the immersed parts with an inert shield.

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Matrix Electropolishing and Plating Apparatus

The nonuniformity of material removal or plating experienced when concurrently treating a plurality of parts in an electrolyte bath is overcome by surrounding the immersed parts with an inert shield.

For material removal, a plurality of elements 1, such as relay reeds, is secured in matrix formation to anode 2. This is located so that the depending tips of the elements are immersed in electrolyte. bath 3 in tank 4. The element matrix is surrounded at its periphery by shield 5 of insulating, inert material such as polyvinyl chloride. Shield 5 extends below the tips of elements 1 and is open at the bottom. Cathode 6 is at the bottom of tank 4 and has a surface area several times larger than the anodic area of elements 1.

During material removal, shield 5 prevents fresh electrolyte from entering the matrix and prevents high current density at the matrix periphery, thus permitting elements 1 to be uniformly polished. The arrangement can also be used to uniformly electroplate elements. The polarities of anode 2 and cathode 6, however, are reversed.

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