Browse Prior Art Database

Circuit Fabrication

IP.com Disclosure Number: IPCOM000096212D
Original Publication Date: 1963-Feb-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Ames, I: AUTHOR

Abstract

The method forms thin film, solid state multilayer electrical components, devices and circuits. A high degree of registration is obtained between the geometric patterns of the various layers. Such more closely controls the electrical characteristics of the completed assembly.

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Circuit Fabrication

The method forms thin film, solid state multilayer electrical components, devices and circuits. A high degree of registration is obtained between the geometric patterns of the various layers. Such more closely controls the electrical characteristics of the completed assembly.

First pattern defining mask 1 determines a selected critical dimension of the multilayer assembly and operates in conjunction with a number of auxiliary pattern defining masks 2, 3 and 4. Mask 1 is rigidly secured during the entire fabrication operation in close proximity to support plate 5. Masks 2, 3 and 4 are movable and selectively interposed in sequence, close to mask 1.

Material forming layer 7 is deposited on support 5 by means of evaporation in a vacuum chamber through the interposed apertures 9 and 10. Other layers as 6 are obtained by changing the movable mask.

A multilayer device is produced having a common geometric dimension A determined by mask 1. The second dimension is related, layer by layer, to the corresponding dimensions B of apertures 9, 11 and 12.

Materials deposited are both conductive and insulating. Conductive plates 8 are provided on support 5 to connect the multilayer device to external circuitry.

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