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Sputtering Monitor

IP.com Disclosure Number: IPCOM000096233D
Original Publication Date: 1963-Feb-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Maissel, LI: AUTHOR [+2]

Abstract

The amount of metal which is deposited during vacuum evaporation is usually monitored by observing the electrical conductivity between regions on an insulating substrate as they are bridged by the deposited metal film. Generally, (upper drawing), the monitoring substrate 2 is made in the form of a long rectangle so that several squares of resistive film, such as between conducting lands 1 and 1', are measured. This is to reduce the percentage error introduced by any uncertainty in the spacing of the conductive areas.

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Sputtering Monitor

The amount of metal which is deposited during vacuum evaporation is usually monitored by observing the electrical conductivity between regions on an insulating substrate as they are bridged by the deposited metal film. Generally, (upper drawing), the monitoring substrate 2 is made in the form of a long rectangle so that several squares of resistive film, such as between conducting lands 1 and 1', are measured. This is to reduce the percentage error introduced by any uncertainty in the spacing of the conductive areas.

In a sputtering system, the monitor (upper drawing) is adversely affected by the glow discharge. From the configuration of the glow discharge path and the potentials applied within the sputtering vacuum chamber, the material which is sputtered onto the monitor, in many cases, turns out to have the same resistance as the glow discharge path resistance. Consequentially, it is not possible to obtain an indication of the amount of material which is deposited.

To overcome this deficiency in the monitor, it is necessary to lower the resistance between the conducting lands 1 and 1' of the monitor. This is accomplished with a monitor (lower drawing), where the insulating gap 4 between conducting lands 5 and 5' is made to be a small fraction of a unit square rather than a number of squares as in the past. In this manner, it is possible to substantially override the resistance of the glow discharge.

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