Browse Prior Art Database

Wrap Around C Clip

IP.com Disclosure Number: IPCOM000096333D
Original Publication Date: 1963-Apr-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Roche, KJ: AUTHOR

Abstract

This is an interconnection method which provides both physical support of a circuit wafer and selective interconnection of deposited circuit elements on either side of the wafer.

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Wrap Around C Clip

This is an interconnection method which provides both physical support of a circuit wafer and selective interconnection of deposited circuit elements on either side of the wafer.

Wafer 4 has deposited on it circuit elements 6, 8 and 10, etc., and conductors 16 used for interconnecting such circuit elements. Additional circuitry is also deposited on the underside (not shown) of wafer 4. At the extremity of each circuit element is a conductive tab 12. It is separated from another conductive tab 14 by a nonconductive portion 13 of wafer 4. C-clips 18 are utilized to interconnect the circuitry on the top and bottom of wafer 4.

Each C-clip has a short tab and a long tab. Dependent upon the tab's orientation, it either does or does not connect the topside circuitry with the underside circuitry. For instance, the long tab of C-clip 18, when in place as shown, bridges nonconductive gap 13 between conductive tabs 12 and 14. Thus, an electrical connection is made between circuit element 10 and the underside circuitry. Alternatively, if it is desired to isolate the topside circuit element, then the short tab is placed over conductor 14 and does not bridge nonconductive gap 13 to conductor 12.

C-clips 18 are also solder-plated and provide a support function. Hence, a number of wafers can be stacked to provide a module and the clips soldered by a solder reflow method. Additionally, the C-clips not only provide a circuit interconnection function and a physic...