Browse Prior Art Database

Ceramic Bonded Circuit Board

IP.com Disclosure Number: IPCOM000096432D
Original Publication Date: 1963-Jun-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

McDonald, G: AUTHOR

Abstract

The circuit board in A has a metal substrate, such as copper or aluminum, coated with an insulating enamel layer constituted primarily of an inorganic resin. While the coating on both sides of the substrate is still in a semi-liquid phase, copper sheets of approximately. 003 of an inch are applied under sufficient pressure to provide intimate contact with the enamel. This type of a circuit board has greater rigidity than epoxy boards. The metallic substrate also serves as a heat sink for the mounted components.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Ceramic Bonded Circuit Board

The circuit board in A has a metal substrate, such as copper or aluminum, coated with an insulating enamel layer constituted primarily of an inorganic resin. While the coating on both sides of the substrate is still in a semi-liquid phase, copper sheets of approximately. 003 of an inch are applied under sufficient pressure to provide intimate contact with the enamel. This type of a circuit board has greater rigidity than epoxy boards. The metallic substrate also serves as a heat sink for the mounted components.

The circuit board in B has a metallic substrate, e. g., aluminum. On this there is an insulating oxide coating provided by anodization, over which a thin layer of metal, e. g., aluminum, copper, or similar metal, is deposited by vapor deposition. This board provides rigidity as well as a heat sink for the mounted components.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]