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Cable Fabrication

IP.com Disclosure Number: IPCOM000096438D
Original Publication Date: 1963-Jun-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Davis, BW: AUTHOR [+2]

Abstract

This device fabricates a multiconductor cable. The cable-forming method first adheres a thin, conductive film F to a flexible substrate B forming a laminate C. Next, film F is cut into conductive strips S according to the desired conductor pattern. Then, flexible substrate B is stretched in its own plane, perpendicular to the longitudinal axis of the strips S. This is effected so as to introduce separations between strips S and provide finished cable C'.

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Cable Fabrication

This device fabricates a multiconductor cable. The cable-forming method first adheres a thin, conductive film F to a flexible substrate B forming a laminate
C. Next, film F is cut into conductive strips S according to the desired conductor pattern. Then, flexible substrate B is stretched in its own plane, perpendicular to the longitudinal axis of the strips S. This is effected so as to introduce separations between strips S and provide finished cable C'.

Laminate C, shown in the cross-section, comprises a flexible substrate B. This is made of thermoplastic sheeting. On this there is adherently superposed conductive thin film F, e. g., aluminum foil adhered thermoplastically to base B. Laminate C is unwound from supply roller R1 by takeup roller R2 so as to pass between the fabricating unit.

This unit has slitter SL which cuts the conductors and separator SEP which separates them. Together, these elements form finished cable C'. While slitter SL and separator SEP are shown as separate rollers, they can comprise one integral unit which both cuts and separates the strips S. A heating source HS is provided to firmly adhere the strips to the substrate B after the cutting by slitter SL.

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