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Gold Plating Technique on Copper for Use at High Temperature

IP.com Disclosure Number: IPCOM000096519D
Original Publication Date: 1963-Jul-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Brown, A: AUTHOR [+4]

Abstract

A Fold plating process that withstands elevated temperatures, i.e., up to 800 degrees C in air and 1000 degrees C in a hydrogen atmosphere, is set forth below: 1. The copper substrate is subjected to ultrasonic cleaning and then rinsed with water. 2. The substrate is now subjected to an alkaline clean (Enthone cleaner 160) at 160 degrees F and then rinsed with water. 3. The cleaned copper substrate is then dipped in 20% HCl and rinsed with water. 4. Next, the substrate is dipped into a nitric acid and sulfuric acid bright dip and rinsed. 5. Now the substrate is dipped in 20% sulfuric acid and rinsed with distilled water. 6. This treated copper substrate is now subjected to electroless nickel plating in the following solution under the conditions indicated. Nickel Chloride 42.5 gr.

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Gold Plating Technique on Copper for Use at High Temperature

A Fold plating process that withstands elevated temperatures, i.e., up to 800 degrees C in air and 1000 degrees C in a hydrogen atmosphere, is set forth below:
1. The copper substrate is subjected to ultrasonic

cleaning and then rinsed with water.
2. The substrate is now subjected to an alkaline

clean (Enthone cleaner 160) at 160 degrees F and then

rinsed with water.
3. The cleaned copper substrate is then dipped in

20% HCl and rinsed with water.
4. Next, the substrate is dipped into a nitric acid

and sulfuric acid bright dip and rinsed.
5. Now the substrate is dipped in 20% sulfuric acid

and rinsed with distilled water.
6. This treated copper substrate is now subjected

to electroless nickel plating in the following

solution under the conditions indicated.

Nickel Chloride 42.5 gr./liter of solution Sodium Citrate 9.0 gr./liter of solution Sodium Hypophosphite 9.0 gr./liter of solution

Distilled water 950 c.c.

Bath Temp. 190 degrees-200 degrees F

Time 30 min.

Steel wire is used to rack the parts since the

steel wire acts as a catalyst. Agitation is

required. Upon completion of the electroless

plating, the electrolessly deposited nickel is

dipped into 20% sulfuric acid to depassivate it

and then it is rinsed in distilled water.
7. The electroless nickel plating is now subjected

to electrolytic action in a gold plating bath

(Temperature) for one hour to obtain a 0.0004-0.0005

inch thickness. The plating is...