Browse Prior Art Database

Superconductor Interconnection Method

IP.com Disclosure Number: IPCOM000096541D
Original Publication Date: 1963-Jul-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 26K

Publishing Venue

IBM

Related People

Quinn, DJ: AUTHOR

Abstract

The method effects connections to superconducting thin films deposited on the surface of a metallic substrate.

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Superconductor Interconnection Method

The method effects connections to superconducting thin films deposited on the surface of a metallic substrate.

The method includes the steps of forming hole 20 through substrate 10. Wire 22 is potted within hole 20 together with an insulating compound 24 having a substantially identical coefficient of thermal expansion as the metal of substrate
10.

After polishing the area to form a planar surface across the interface between potting compound 24 and substrate 10, a thin insulating coating 26 is applied to the surface of 10. Then, strip lines 16 and ground planes 12, insulated from each other by insulating layer 28, are deposited directly. Such is on coating 28 across the interface. On the other side of substrate 10, electrical connections are made to connector wire 22 by soldering or other fastening methods.

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