Browse Prior Art Database

Thin Film Universal Connector Panel

IP.com Disclosure Number: IPCOM000096633D
Original Publication Date: 1963-Sep-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 115K

Publishing Venue

IBM

Related People

Jenny, FF: AUTHOR

Abstract

This thin film universal connector panel for digital applications provides flexibility of interconnection, reduces the time for fabricating unique circuit panels and eliminates the requirement for expensive masks in fabricating the unique panels. These advantages are achieved by the deposition of one universal circuit and crossover grid pattern with insulation through masks, and by the final coating of this repetitive pattern with one continuous copper sheet. This is subsequently coated with photoresist and etched to a line pattern connecting the various underlaying circuit and jumper land areas in a way which yields the desired specific circuit function.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 68% of the total text.

Page 1 of 2

Thin Film Universal Connector Panel

This thin film universal connector panel for digital applications provides flexibility of interconnection, reduces the time for fabricating unique circuit panels and eliminates the requirement for expensive masks in fabricating the unique panels. These advantages are achieved by the deposition of one universal circuit and crossover grid pattern with insulation through masks, and by the final coating of this repetitive pattern with one continuous copper sheet. This is subsequently coated with photoresist and etched to a line pattern connecting the various underlaying circuit and jumper land areas in a way which yields the desired specific circuit function.

One method of fabricating the thin film panel, shown in Steps I, II, III and IV, evaporates a plurality of basic circuit resistor patterns at locations A, B, etc., on a panel 1. One basic circuit pattern found to be satisfactory for the process is a resistor-type Nor described in U. S. Patent No. 3, 075, 089.

The Nor has at least three input resistors 2, 3 and 4 and a load resistor 5. The resistor material is evaporated onto the panel by the usual masking techniques. Then, a basic crossover connector pattern is evaporated through masks as indicated in Step II, consisting of lines 6, 7, 8, 9, 10, etc., of highly conductive metal such as copper. In Step III, the active part of the resistors and the bridging part of the crossover lines is covered with an insulator film evaporated...