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Modular Pneumatic Logic Package

IP.com Disclosure Number: IPCOM000096715D
Original Publication Date: 1963-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 82K

Publishing Venue

IBM

Related People

Langley, RF: AUTHOR [+2]

Abstract

As shown in A, this modular, three-dimensional pneumatic logic package has seal plane 1 sandwiched between element plane 2 and circuit plane 3. Plane 2 has at its outer side a plastic substrate 2a (see B) into which manifolding is premolded. Bonded to the substrate of plane 2 is photopolymer 2b into which are etched pneumatic logic elements 4. Plane 1 is pre-punched tape having adhesive coating on both sides. This tape is laid over photopolymer 2b to provide a leakproof seal. It has uniformly spaced punched through holes 5 to provide ports permitting fluid pressure communication between plane 2 and plane 3.

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Modular Pneumatic Logic Package

As shown in A, this modular, three-dimensional pneumatic logic package has seal plane 1 sandwiched between element plane 2 and circuit plane 3. Plane 2 has at its outer side a plastic substrate 2a (see B) into which manifolding is premolded. Bonded to the substrate of plane 2 is photopolymer 2b into which are etched pneumatic logic elements 4. Plane 1 is pre-punched tape having adhesive coating on both sides. This tape is laid over photopolymer 2b to provide a leakproof seal. It has uniformly spaced punched through holes 5 to provide ports permitting fluid pressure communication between plane 2 and plane 3.

Plane 3 is of magnesium etched with X circuitry 6 on one side and Y circuitry 7 on the other. Holes 8 are drilled through the plane to interconnect selected X and Y circuits. Fluid pressure supply ports 9 pass completely through the three planes 1, 2 and 3 to convey pressure fluid to and through the various modules of adjacent packages.

Pressure fluid from 9 is supplied via branches 10 to each element 4. Etched channels, like 11, lead from each element to respective holes 12 drilled through plane 2 and aligned with holes 5 or 8. Cavities like 13 are etched in substrate 2b and in plane 3 to define the locations at which holes 12 and 8 are drilled.

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