Browse Prior Art Database

Module Assembly

IP.com Disclosure Number: IPCOM000096717D
Original Publication Date: 1963-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Cochran, TJ: AUTHOR [+3]

Abstract

In miniaturization, components and circuits are built on substrates and assembled in stacks. If excessive amounts of heat are used for any prolonged period, the circuits and components are damaged. To prevent this, the following method is used.

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Module Assembly

In miniaturization, components and circuits are built on substrates and assembled in stacks. If excessive amounts of heat are used for any prolonged period, the circuits and components are damaged. To prevent this, the following method is used.

A welder has table 10, four upright angle bars 11 forming a cage, and two plates of insulating material 12 and 14. On these are mounted a plurality of spring-pressed electrodes 15. Plate 12 rides up and down freely between the uprights 11. Plate 14 is held in frame 16 fastened below aperture 17 in table 10.

To connect a series of substrates 20 stacked one above the other, pin connectors 21 are first tinned. Then, the end of each pin is trimmed. Two substrates are next placed in the cage formed by the uprights 11. The lower ends of pins 21 are in alignment and in contact with the electrodes of plate 14. Plate 12 is then lowered into the cage with its electrodes in contact with the tops of the pins in the upper substrate. A half-cycle AC welding circuit, connected to leads 22, is then pulsed supplying a welding pulse to all electrodes, simultaneously. The electrodes in plate 14 are so adjusted that the first substrate is supported clear of table 10. This insures even pressure on all electrodes and pins when plate 12 is lowered into position. To add a third substrate to the stack, it is only necessary to remove plate 12, add a substrate and repeat the operation.

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