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Browse Prior Art Database

Multiple Vacuum Chamber System

IP.com Disclosure Number: IPCOM000096758D
Original Publication Date: 1963-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Connell, RA: AUTHOR [+3]

Abstract

The multiple vacuum chamber system has a plurality of vacuum chambers, not shown, each defining a fabrication stage which a particular vapor deposition process, e.g., vapor deposition of particular metals or insulating materials, is effected. Each vacuum chamber includes equipments for effecting the particular fabrication process and also a continuously operated vacuum pump.

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Multiple Vacuum Chamber System

The multiple vacuum chamber system has a plurality of vacuum chambers, not shown, each defining a fabrication stage which a particular vapor deposition process, e.g., vapor deposition of particular metals or insulating materials, is effected. Each vacuum chamber includes equipments for effecting the particular fabrication process and also a continuously operated vacuum pump.

The vacuum chambers are arranged in radial fashion about cylindrical housing 1. Substrates 3 to be acted upon are set within recesses 5 defined in journal 7 positioned within housing 1. Housing 1 defines access ports 9 having flange members 11 for connection to a vacuum chamber and also work port 13 at which substrates 3 can be substituted. Substrates 3 are selectively positioned in the vacuum chambers by rotating journal 7 to align recesses 5 with access ports
9. Journal 7 is closely fitted within housing 1 with 0. 001 inch tolerance as indicated at 15 to impede pressure leakage between the vacuum chambers during a positioning cycle.

When recesses 9 and access ports 11 are aligned, a vacuum seal between the vacuum chambers is achieved by introducing liquid nitrogen along cooling coil 17. This induces sufficient thermal contraction to bring housing 1 into contact with journal 7. The vacuum seal thus obtained prevents cross contamination between deposition processes effected concurrently in the vacuum chambers. To advance substrates 3, liquid nitrogen flow along...