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Applying Photoconductive Elements on Nonconductive Substrates

IP.com Disclosure Number: IPCOM000096809D
Original Publication Date: 1963-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Immendorfer, M: AUTHOR

Abstract

When manufacturing printed circuits, it is frequently required to deposit, between two electrodes, photoconductive substances, electroluminescent substances, etc. Where necessary, they are formed by thermal treatment. Some printing or spraying methods have a number of serious disadvantages. These are waste of material and poor reproducibility of the applied layers. Such are largely avoided by this method.

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Applying Photoconductive Elements on Nonconductive Substrates

When manufacturing printed circuits, it is frequently required to deposit, between two electrodes, photoconductive substances, electroluminescent substances, etc. Where necessary, they are formed by thermal treatment. Some printing or spraying methods have a number of serious disadvantages. These are waste of material and poor reproducibility of the applied layers. Such are largely avoided by this method.

Upon plate 1 consisting of an insulating material, electrode 2 consisting of a thin gold layer is deposited. The entire arrangement is then placed in a suspension containing photoconductive and doping substances. An electric field is produced between electrodes 2 and 10. Thus, the suspended substances of the suspension are deposited by electrophoresis as layer 4 upon electrode 2. After layer 4 is sintered and formed by thermal treatment, insulating layer 5 and second electrode 3 are applied.

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