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Quality Control of Capacitor Arrays

IP.com Disclosure Number: IPCOM000096828D
Original Publication Date: 1963-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Hecht, R: AUTHOR [+2]

Abstract

This testing array rapidly and accurately distinguishes between accepted and rejected thin film capacitors. The defective elements can be optically or manually separated from the accepted elements.

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Quality Control of Capacitor Arrays

This testing array rapidly and accurately distinguishes between accepted and rejected thin film capacitors. The defective elements can be optically or manually separated from the accepted elements.

Thin film capacitors 10, including a first plate 12 and a second plate 13 separated by dielectric 14, are fabricated on a substrate 15 by evaporation, sputtering or the like. As shown, capacitors 10 are fabricated on one surface of substrate 15. Conductive electrodes 12 and 13 can be deposited on opposite surfaces of the substrate. After fabrication of the capacitor unit, the substrate is divided into individual elements by dicing. prior to dicing, however, all elements must be tested for capacitance to differentiate between accepted and rejected elements.

A capacitor testing array, including a standard go no go testing unit 20 is connected through cable 22 to test probe 24. A plurality of contact members 26 is secured in probe 24. Each pair of members 26 is individually connected through separate leads in cable 22 to unit 20. Probe 24 is superimposed above the substrate. Members 26 are arranged to contact each set of plates in the element. Unit 20 operates to sequentially scan each set of test probes.

As a set of test probes is inspected, the capacitance is compared with a standard. Unit 20 provides a pulse of current in the probe to record a burn mark on the surface of the particular element inspected when determined to be defectiv...