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Browse Prior Art Database

High Thermal Conductance Substrate

IP.com Disclosure Number: IPCOM000096914D
Original Publication Date: 1962-Jan-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Engel, JM: AUTHOR

Abstract

The high thermal conductance substrate provides cooling and also electrical isolation.

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High Thermal Conductance Substrate

The high thermal conductance substrate provides cooling and also electrical isolation.

The metal heat sink usually comprises a high thermal conductivity material such as copper plate. Onto the copper, a thin film of tantalum is evaporated or sputtered. A portion of it is oxidized by means of anodizing. Electrodes are next added on the oxide layer Ta(2) O(5) by an additive printed circuit process. Over the area between the electrodes there is deposited a thin film photoconductor CdSe, CdS. Vacuum evaporation or sputtering techniques combined with techniques for electrolytic anodization in dilute acids provide exceedingly good controls for this method. A simple application is shown, but much more complicated arrangements can be achieved. Thus, frequently parts of the supported structure may have to be grounded. This is done easily by at least three methods. 1. Evaporate or sputter the tantalum through masks. 2. Coat previously evaporated tantalum in desired places with a wax so as to inhibit subsequent oxidation. 3. Use printed circuit processes on top of the anodized tantalum to deposit metallic film electrodes, if a ground or common

interconnection is needed that is to be insulated from the

substrate.

The main advantages of this method are as follows:

1. A high thermal conductivity substrate.

2. A high dielectric strength insulation.

3. A high resistivity insulation.

4. High temperature, stable materials.

5. A structure adapted...