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Superconducting Colloidal Suspension Substrate

IP.com Disclosure Number: IPCOM000097058D
Original Publication Date: 1962-Apr-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Giedd, GR: AUTHOR [+2]

Abstract

This is a fabricated substrate for use with superconductive circuits. The substrate has a coefficient of expansion equal to that of the material deposited on it.

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Superconducting Colloidal Suspension Substrate

This is a fabricated substrate for use with superconductive circuits. The substrate has a coefficient of expansion equal to that of the material deposited on it.

An epoxy-resin substrate 2 has imbedded in it tiny lead particles or other particles that became superconductive at temperatures near absolute zero. Wires 4 of copper, or other conductive material, are imbedded in a predetermined pattern in the substrate. Such form conductive paths between one substrate and a contacting substrate. An evaporated film of superconductive material is deposited onto the surface 6 of the substrate, the film joining contacts 8 to form a thinfilm circuit.

The particles of hard superconducting material surrounding wires 4 lower the field effects of the current-carrying conductors 4 and produce low inductive paths. Wires 4, protruding as points from the substrate, provide good conductive paths between areas of each contacting substrate. Thus, the entire substrate serves as an improved ground plane in superconductive circuits.

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