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Thermal Compression Bonding

IP.com Disclosure Number: IPCOM000097069D
Original Publication Date: 1962-May-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Kennedy, A: AUTHOR [+2]

Abstract

In securing leads to transistors and other miniaturized components, the wires are usually .0005 to .001 in diameter. In bonding, the movement of a chisel shaped member of sapphire and the wire to a common point must be done with extreme accuracy. The device handles this requirement.

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Thermal Compression Bonding

In securing leads to transistors and other miniaturized components, the wires are usually .0005 to .001 in diameter. In bonding, the movement of a chisel shaped member of sapphire and the wire to a common point must be done with extreme accuracy. The device handles this requirement.

Mounted on base 10 are carriages 11 and 12. One carries the chisel which is electrically heated and the other a wire feeder. Located Between the carriages is column 14 having aperture 15 in the head into which holders for components of differing shapes are secured. Column 14 is rotated by knurled collar 16 to orient a component. An electric heater 19 within 14 preheats the component.

Two members 17 and 18 are slidable on one another, 18 being secured to the upper half of a base member 20. The carriage 11 is secured to member 17. A pair of cams, secured to a split shaft journalled in base 10, are rotated by pantagraph 21 under control of chessman 22. These cams, not shown, act on the interior of the base members 20 to control the movement of carriages 11 and 12 relative to one another. Micrometer stops 23 and 24 adjust the relative initial positions of members 17 and 18. Any movement of chessman 22 results in a minute movement of carriage 11. This is formed with an upstanding crosshead 25 on which is slidably mounted a bracket 26 carrying sapphire chisel 27. Pin 28 in the crosshead is connected by driving link 30 to disk 31 driven by motor 32. Rack 33 and pi...