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Preparing Printed Circuits

IP.com Disclosure Number: IPCOM000097074D
Original Publication Date: 1962-May-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Immendorfer, M: AUTHOR

Abstract

The circuits are not applied directly on the substrates, but first on webs or foils of plastic materials, paper or fabric, which are easily stacked.

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Preparing Printed Circuits

The circuits are not applied directly on the substrates, but first on webs or foils of plastic materials, paper or fabric, which are easily stacked.

For preparing the final printed circuits, the foils are placed upon a substrate, either glass or ceramic material. The circuits are transferred by pressure, heat or special solvents.

By placing side by side or superimposing a plurality of foils bearing different circuits and circuit components, circuits are obtained having any desired degree of complexity by using a limited number of standard types. By selecting the sequence in which the individual standard circuits are transferred to the substrate, it is possible to produce circuits including elements which are manufactured or formed under conditions partly excluding each other.

Thus, it is possible to produce the conductors of a circuit by annealing a gold paste at a temperature of 700 degrees C and thereafter to apply the substances of photoelectric elements and resistors included in the circuit. These are formed at the maximum permissible temperature of 500 degrees C.

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