Browse Prior Art Database

Ejection Soldering

IP.com Disclosure Number: IPCOM000097134D
Original Publication Date: 1962-Jun-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Schulz, PR: AUTHOR

Abstract

Superheated solder in metered quantities is ejected or dropped from a nozzle onto a joint to be connected. The temperature to which the solder is superheated is such that its energy content is great enough to bring the parts to be joined up to the melting point of the solder as the solder is cooling down to the melting point.

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Ejection Soldering

Superheated solder in metered quantities is ejected or dropped from a nozzle onto a joint to be connected. The temperature to which the solder is superheated is such that its energy content is great enough to bring the parts to be joined up to the melting point of the solder as the solder is cooling down to the melting point.

Shuttle 1 reciprocates in the superheated solder 2 in coordination with ram 3 to meter and deliver superheated solder to joint 4. The approximate temperature to which the solder must be superheated is as follows:

T1 = (3(Dt + d/2/)/D/2/ - 3d/2/ * S2/S1 * C2/C1 >T2-T3|) + T2 where D = diameter of land on printed circuit board

t = thickness of land on printed circuit board d = diameter of component lead S1 = specific gravity of solder S2 = specific gravity of joint material (usually copper) C2 = specific heat of joint material (usually copper) C1 = specific heat of solder T2 = soldering temperature (i. e., liquidus temperature) T3 = initial temperature of joint

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