Browse Prior Art Database

Film Application of Electrically Conducting Coatings

IP.com Disclosure Number: IPCOM000097203D
Original Publication Date: 1962-Jul-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Elser, TG: AUTHOR

Abstract

The method is for applying highly accurate, electrically conductive and pretinned patterns on insulating substrates. The resultant patterns are used for interconnecting component containing circuit modules which are attached to an insulating substrate.

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Film Application of Electrically Conducting Coatings

The method is for applying highly accurate, electrically conductive and pretinned patterns on insulating substrates. The resultant patterns are used for interconnecting component containing circuit modules which are attached to an insulating substrate.

A layer of high temperature solder 10 is deposited on a self supporting plastic tape 11. Over the solder 11 is deposited a layer of metalized powder mixed with a binder. Both the layer of solder 10 and the layer of metalized powder 12 are allowed to dry. The tape is turned over so that the layer of metalized powder 12 rests on an insulating substrate 13. The tape is removed and the assembly is heated to cure the metalized powder and provide a bond between the solder and the insulating substrate. The carrier tape can be preformed by punching to provide desired interconnecting circuit configurations.

This process lends itself to mass production techniques and provides circuit patterns having improved resolution and uniform electrical parameters.

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