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Thin Film Miniaturized Circuitry

IP.com Disclosure Number: IPCOM000097227D
Original Publication Date: 1962-Jul-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 75K

Publishing Venue

IBM

Related People

Maissel, L: AUTHOR

Abstract

Thin film circuits feature a favorable surface to volume ratio. Such promotes good power dissipation and eliminates the necessity for soldered joints between components. However, when it is necessary to combine several such circuits into a larger unit, both these features partly disappear. The close-packed surfaces of such a larger unit are difficult to cool. Connection between individual thin film circuits is usually effected by means of soldered wiring extending along the outside edges of the unit.

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Thin Film Miniaturized Circuitry

Thin film circuits feature a favorable surface to volume ratio. Such promotes good power dissipation and eliminates the necessity for soldered joints between components. However, when it is necessary to combine several such circuits into a larger unit, both these features partly disappear. The close-packed surfaces of such a larger unit are difficult to cool. Connection between individual thin film circuits is usually effected by means of soldered wiring extending along the outside edges of the unit.

Metal thin film components are laid down on insulating substrates. The latter inherently afford poor thermal conductivity and power dissipation. To minimize these conditions, individual metal substrates are employed. These have one surface partially covered with a thin layer of glass which, in turn, has a film circuit applied to it. The glass layer is thick enough to minimize capacitive losses between the thin film circuit and the metal substrate or backing, which is grounded. A five mil layer of glass on a 10 mil metal backing is a representative thickness.

Drawing A shows a single metal backing member 10 with a glass layer 11 applied to a portion of one surface. A thin film circuit 12, shown diagrammatically, is deposited on glass layer 11. Ground connections 13 and 14 extend around one edge of layer 11 and contact the metal backing member 10. The remaining wiring terminal 15 extends around the opposite edge.

Backing members 10 and...