Browse Prior Art Database

Making Pneumatic Logic Devices

IP.com Disclosure Number: IPCOM000097324D
Original Publication Date: 1962-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Langley, RF: AUTHOR

Abstract

E.I. du Pont de Nemours & Co., Inc. has developed DYCRIL printing plates that are widely used in the printing industry. Each such plate comprises a thin layer of a photosensitive plastic or photopolymer which is bonded to one side of a metal backing sheet. To photoetch the printing plate, a negative is placed in contact with the photosensitive layer. The plate is then exposed to the negative by strong ultra-violet light which strikes the intended areas of the plastic layer and makes them insoluble. The unexposed, unaffected photosensitive material is then removed from the plate by a spray comprising water and a diluted solution of sodium hydroxide.

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Making Pneumatic Logic Devices

E.I. du Pont de Nemours & Co., Inc. has developed DYCRIL printing plates that are widely used in the printing industry. Each such plate comprises a thin layer of a photosensitive plastic or photopolymer which is bonded to one side of a metal backing sheet. To photoetch the printing plate, a negative is placed in contact with the photosensitive layer. The plate is then exposed to the negative by strong ultra-violet light which strikes the intended areas of the plastic layer and makes them insoluble. The unexposed, unaffected photosensitive material is then removed from the plate by a spray comprising water and a diluted solution of sodium hydroxide.

To obtain the substantially straight side walls necessary for channels of pneumatic logic devices, du Pont suggests columnating the light from the ultra- violet source and eliminating the conditioning step of storing the unexposed DYCRIL plate in a carbon dioxide atmosphere for at least twenty-four hours prior to printing.

In this method of making pneumatic logic devices, photosensitive plastic layers are bonded on both sides of the metal backing sheet. Thus, orthogonal circuits with substantially straight side walls can be photoetched either concurrently or sequentially in each of the layers. The various logic elements preferably are arranged so that, in the elements etched in one layer, the fluid flows are generally in one direction, the X-axis direction. The elements photoetched in the...