Browse Prior Art Database

Selenium Diode Package

IP.com Disclosure Number: IPCOM000097363D
Original Publication Date: 1962-Oct-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 58K

Publishing Venue

IBM

Related People

Schulz, PR: AUTHOR

Abstract

The selenium diode package contains and relates to a plurality of diodes for mounting on printed circuit cards.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Selenium Diode Package

The selenium diode package contains and relates to a plurality of diodes for mounting on printed circuit cards.

Molding 10 has a series of through openings 11 each having pairs of opposing grooves 12. In the outer grooves 12 are retained two spring members 13 and 14, while the central grooves receive a diode. Bus 15 extends above the top of molding 10 and connects the springs 13. Bus 16 similarly connects the springs 14.

The springs have respective struck-out fingers 17 and 18 which resiliently engage the diode on either side. Embossments 19 retain the springs in the grooves 12 while tabs 20 connect to the printed circuit card. Various And and Or circuit combinations are obtained by snipping the bus at 21 at the time of assembly to the printed circuit card.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]