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Conditioning Ceramic Substrates for Circuit Patterns

IP.com Disclosure Number: IPCOM000097378D
Original Publication Date: 1962-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Altman, EK: AUTHOR

Abstract

Before circuit patterns are metallized on a ceramic surface, the surface is activated with a printing ink containing Pd black.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Conditioning Ceramic Substrates for Circuit Patterns

Before circuit patterns are metallized on a ceramic surface, the surface is activated with a printing ink containing Pd black.

To activate the ceramic with the ink, the ink is rolled over a reversed positive stamp, representing the outline of the desired circuit pattern, which, in turn, is placed on the ceramic. Following this, the surface is heated to burn off the organic residue.

This leaves a catalytic palladium oxide in the shape of the required pattern and provides a source of nuclei for plating the printed circuit metal to the ceramic.

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