Browse Prior Art Database

Rapid Deposition of Electroless Nickel

IP.com Disclosure Number: IPCOM000097379D
Original Publication Date: 1962-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Koretzky, H: AUTHOR [+2]

Abstract

Alkaline electroless nickel baths normally deposit nickel at a rate equal to only one-fifth to one-sixth that of the acid electrolytes. Now, by the addition of various bath soluble amines, either alone or in combination in high concentration, the plating rate of the alkaline systems is made to equal, and even in some cases to surpass, that of the acid systems.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Rapid Deposition of Electroless Nickel

Alkaline electroless nickel baths normally deposit nickel at a rate equal to only one-fifth to one-sixth that of the acid electrolytes. Now, by the addition of various bath soluble amines, either alone or in combination in high concentration, the plating rate of the alkaline systems is made to equal, and even in some cases to surpass, that of the acid systems.

In addition to the increased rate of deposition, the baths are stable to pH fluctuations, due to buffering ability of the amines, and the deposits produced are bright and fine grained. Bath life is increased by the incorporation of known stabilizers without too markedly affecting the deposition rate. A representative bath composition is as follows: Nickel Chloride 39 gm/l

Sodium Hypophosphite 10 gm/l

Ammonium Chloride 50 gm/l

Triethenolamine 117 ml/l

or

Morpholine 77 ml/l

pH over 7.5

Temperature 85 degrees C to boiling

1