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Integrated Circuit Modules and Core Planes

IP.com Disclosure Number: IPCOM000097390D
Original Publication Date: 1962-Nov-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Schwartz, RS: AUTHOR

Abstract

This is a process for interconnecting circuit elements and is suitable for mass production techniques.

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Integrated Circuit Modules and Core Planes

This is a process for interconnecting circuit elements and is suitable for mass production techniques.

In one form, an insulating or printed circuit board 20 has a plurality of cavities 21 to receive encapsulated transistors 22 or diodes 24 of planar configuration. The cavity shapes conform to the particular component desired to be positioned. The diodes and transistors are arranged to have metal ball type terminals 26. A heat sink member 30 is secured to the side of board 20 opposite to that having cavities 21. Terminals 32 are staked in board 20 at preselected points. Terminals 32 are also insulated from member 30.

Board 20 is placed in a shake table (not shown) and the transistor and diodes are vibrated into the correct cavity. Terminals 26 extend above the surface of the board. The surface having cavities 21 is coated with an insulating paste 34 so that the height of terminals 26 is covered. Next, material 34 is lapped to expose a portion 29 of terminals 26. Metallized connections 28 are made between balls 26 and staked terminals 32.

In another form, the process secures a plurality of spaced metal strips 40 to an insulating surface 42. Strips 40 are disposed in one or more different quadrants. Ball terminals 44 are secured to corresponding ends of strips 40. Terminals 44 are arranged in a circular pattern so that a magnetic core 46 can be positioned about the terminals. Surface 42 is covered with a potting material 4...