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Producing Metalllc Deposits

IP.com Disclosure Number: IPCOM000097434D
Original Publication Date: 1962-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Marshall, JH: AUTHOR

Abstract

This is a process for producing a copper layer with superior properties from the point of view of adhesion, hardness, tarnish resistance and electrical conductivity. The layer is obtained by electroless deposition of copper from a reducible copper solution on a nonconductive body such as paper.

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Producing Metalllc Deposits

This is a process for producing a copper layer with superior properties from the point of view of adhesion, hardness, tarnish resistance and electrical conductivity. The layer is obtained by electroless deposition of copper from a reducible copper solution on a nonconductive body such as paper.

The body is immersed in an alkaline copper solution, reducible by formaldehyde in the presence of heat to metallic copper. Heat and pressure are applied to the impregnated body to reduce the copper salts deposited on it to partially reduced oxides and hydroxides of copper. Metallic copper is then deposited on the body by re-immersing the body in the alkaline copper solution.

The alkaline copper comprises, for example, 1% by weight copper sulfate, 1% by weight glycerine, 2% by weight sodium hydroxide, 2.8- 3.7% by weight formalin (37%) and the balance water.

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