Browse Prior Art Database

Cross Core Memory Construction

IP.com Disclosure Number: IPCOM000097470D
Original Publication Date: 1962-Dec-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Anderson, JL: AUTHOR [+3]

Abstract

A copper base, formed to remove stresses, greatly improves the characteristics of a cross core memory device.

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Cross Core Memory Construction

A copper base, formed to remove stresses, greatly improves the characteristics of a cross core memory device.

Cross core memory devices have previously been made by punching or etching out strips from a nickel-iron magnetic sheet. Word currents in such devices pass directly through the magnetic strip, which provides considerable electrical resistance.

The copper base provides a high conductance current carrier for word currents. The nickel-iron memory elements are plated over the copper, on, over and around circular bit areas. Bit wires passing through holes in the middle of the bit areas complete the memory elements.

In operation, a damped alternating sine wave in the word direction on the copper strip both reads and writes. The leading edge of the damped wave reads data by inducing output pulses on the bit sense line. These output pulses are sensed by sense amplifiers, not shown. The later portion of the damped wave, in coincidence with bit pulses on the bit sense conductors, writes the cores. The copper strip connecting the adjacent bit areas is formed in a sinusoidal bend to relieve stress due to expansion of the copper strip.

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