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Electrodeposited Thin Metallic Film Elements

IP.com Disclosure Number: IPCOM000097561D
Original Publication Date: 1961-Feb-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Lloyd, JC: AUTHOR [+3]

Abstract

The method provides for electroplating a thin magnetic film on a metal base and then removing the layer.

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Electrodeposited Thin Metallic Film Elements

The method provides for electroplating a thin magnetic film on a metal base and then removing the layer.

A thin sheet of metallic material 10, preferably one which is soluble in a solution in which the magnetic film is insoluble, is utilized as a conducting substrate. A metallic alloy 11 such as one composed of an 80 per cent Ni-20 per cent iron composition is electroplated on 10. A thin base resistant glue 12 is then applied to the surface of the nickel-iron alloy and a plastic or other non- conducting substrate 13 is glued on 12.

The assembled laminar structure is placed in a solution 14 which is strong enough to dissolve away the metallic material 10, yet is weak enough to leave the magnetic film 11 uneffected. After removal of the metallic material 10, the material 13 remains as the supporting substrate.

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