Browse Prior Art Database

Thin Film Electronic Circuits

IP.com Disclosure Number: IPCOM000097638D
Original Publication Date: 1961-Mar-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Jones, RA: AUTHOR [+2]

Abstract

A thin film electronic circuit package is fabricated by first depositing a layer of silicon monoxide on the ceramic substrate. The silicon monoxide layer provides a smooth surface and reduces pin hole failures in the ground and voltage planes.

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Thin Film Electronic Circuits

A thin film electronic circuit package is fabricated by first depositing a layer of silicon monoxide on the ceramic substrate. The silicon monoxide layer provides a smooth surface and reduces pin hole failures in the ground and voltage planes.

Subsequently, a ground plane is deposited onto the silicon monoxide layer followed by deposition of a layer of silicon monoxide for insulation. A voltage plane is positioned over the ground plane and a final insulation layer of silicon monoxide is added. The deposition of the voltage plane directly over the ground plane provides a high distributed capacitance due to the small insulation thickness.

The distributed capacitance cancels out the noise signals. The ground plane and voltage plane may be of aluminum or other electrical conductors.

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