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Superconductive Interplane Coupler

IP.com Disclosure Number: IPCOM000097650D
Original Publication Date: 1961-Mar-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Kahan, GJ: AUTHOR

Abstract

The technique provides superconductive connections between thin film superconductive circuits formed on adjacent substrates.

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Superconductive Interplane Coupler

The technique provides superconductive connections between thin film superconductive circuits formed on adjacent substrates.

Each substrate is provided with a recessed slot at the coupling area to which is bonded a material which exhibits good adhesion to the glass substrate. This material may be chromium, evaporated copper, or silver paint. Next, a preshaped superconductive lead plug is soldered to the glass bonded material to insure mechanical strength and provide a continuous superconductive ground plane.

Lead is then evaporated to electrically connect the plug to the superconductive lead ground planes pre-existing on each of the substrates. Afterwards, the plug is coated with an insulating layer such as silicon monoxide or an organic coating material. Finally, additional lead is evaporated to interconnect the circuits laid down on the individual substrates.

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