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Integrated Circuit Package

IP.com Disclosure Number: IPCOM000097724D
Original Publication Date: 1961-May-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 3 page(s) / 106K

Publishing Venue

IBM

Related People

Schwartz, RS: AUTHOR

Abstract

Active circuit elements such as transistors and diodes are combined in operative relation with passive circuit elements such as printed resistors and circuit connections to form an integrated circuit package.

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Integrated Circuit Package

Active circuit elements such as transistors and diodes are combined in operative relation with passive circuit elements such as printed resistors and circuit connections to form an integrated circuit package.

At A there is an N-type silicon wafer 10 which has P-type regions 11 diffused along one side to form junction diodes or the base regions of transistors. N-type regions 12 are diffused into the upper surface of certain of the regions 11 to form transistors. A protective glass film 13 having a thickness of about one mil is formed over the entire upper surface of the unit.

In the next fabrication step, holes 14 are etched with hydrofluoric acid in 13
(B). This exposes portions of the upper surfaces of the P-type and N-type regions so that terminals may be applied. These terminals, together with conductive connections and resistors, are applied by metal evaporation or sputtering techniques over those exposed portions and over the predetermined portions of the surface of 13. This step forms a pattern such as represented at C, i.e., a top plan view of the B assembly after the metal deposition operation. The transistors and diodes exist in the regions of the plurality of circles of different diameters. The single shaded regions 15 constitute conductive connections of negligible resistance while the cross-hatched regions 16 constitute evaporated film resistors. The single shaded regions 17 of somewhat larger area are conductive connections or lands to facilitate connecting the completed unit to an external circuit.

The structure now includes the various resistors and the desired wiring paths and the various transistor and diode elements. However, all the transistors and diodes are electrically connected together through the thin si...