Browse Prior Art Database

Thermal Free Soldering and Brazing Alloys

IP.com Disclosure Number: IPCOM000097790D
Original Publication Date: 1961-Jul-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 3 page(s) / 128K

Publishing Venue

IBM

Related People

Manko, HH: AUTHOR

Abstract

The pair of tables lists seventeen sets of soldering and brazing alloys so compounded as to yield thermal free joints in connection with the related base metals.

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Thermal Free Soldering and Brazing Alloys

The pair of tables lists seventeen sets of soldering and brazing alloys so compounded as to yield thermal free joints in connection with the related base metals.

A solder joint is essentially a junction of dissimilar metals and, if there is a thermal gradient across it, a certain amount of emf is generated. This electromotive force is designated as thermal emf and has been measured and reported in the literature. It is important to eliminate thermal emf, especially in low current devices.

To effect such elimination, the tables show various soldering and brazing alloys that are so matched or related to the base metals carrying current into and out of the junction as to be thermal free.

In other words, the joints or junctions are to be made as thermocouples which generate no emf with changes in temperature. SEE ORIGINAL FOR TABLES p13-14

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