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Browse Prior Art Database

Solderable Contact Adhesive

IP.com Disclosure Number: IPCOM000097791D
Original Publication Date: 1961-Jul-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Manko, HH: AUTHOR

Abstract

In order to obtain solder wetting of non-metallics such as ceramics and either glass or refractory metals, a compound which can be applied as an adhesive to a non-metallic surface is formulated. It is also solderable due to presence of a metallic filler in the adhesive.

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Solderable Contact Adhesive

In order to obtain solder wetting of non-metallics such as ceramics and either glass or refractory metals, a compound which can be applied as an adhesive to a non-metallic surface is formulated. It is also solderable due to presence of a metallic filler in the adhesive.

Examples of use are either the attachment of leads to high resistance carbon blocks or the fastening of an alumina element to Kovar* leads prior to soldering. In some cases the need for vapor deposited lands or other metallic deposits is eliminated.

The formulation of the material comprises any high temperature resin such as an epoxy. Suspended in the resin is a solderable metal filler such as copper particles or other metallic powder. The material has a consistency suitable for application by silk screening, brushing, or dipping. The reduction of oxides on the copper prior to formulation and the addition of deoxidizing stabilizers during storage are additional formulating steps.

A terminal 12 extends through a non-metallic base 13. In order to attach the terminal to the base, a layer 10 of the adhesive resin with metallic particles 11 is first deposited on the base and around the terminal. Then solder 14 is deposited on layer 10 so that terminal 12 is connected to base 13. * Kovar is a trademark of Westinghouse Electric.

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