Browse Prior Art Database

Preparing Molded Circuits

IP.com Disclosure Number: IPCOM000097845D
Original Publication Date: 1961-Aug-01
Included in the Prior Art Database: 2005-Mar-07
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Radovsky, DA: AUTHOR

Abstract

By combining the advantages of both the standard printed circuit etching techniques and established molding procedures, printed circuits are molded into shapes not easily attained otherwise. Examples of such printed and molded circuits are shown in the drawings. The circuit foil conductors 1 and adhesive film 4 are formed (simultaneously with molding) into right angle bends which may be formed either flush on the inside of a U-shaped substrate 2 (left) or on the outside of a U-shaped substrate 3 (right).

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 57% of the total text.

Page 1 of 2

Preparing Molded Circuits

By combining the advantages of both the standard printed circuit etching techniques and established molding procedures, printed circuits are molded into shapes not easily attained otherwise. Examples of such printed and molded circuits are shown in the drawings. The circuit foil conductors 1 and adhesive film 4 are formed (simultaneously with molding) into right angle bends which may be formed either flush on the inside of a U-shaped substrate 2 (left) or on the outside of a U-shaped substrate 3 (right).

Initially, regular printed circuit grade, adhesive coated copper foil is carefully subjected to conventional printed circuit etching processes involving coating with resist and etching away of unwanted metal. What is obtained at this point is a flexible foil, printed circuit pattern supported on a still curable and highly flexible base of adhesive film.

This flexible foil circuit is then placed in a mold with the adhesive portion of the circuit in direct contact with a suitable molding material. The whole assembly is then subjected to heat and pressure to form the molded flush circuit of a desired configuration.

The most satisfactory results are obtained by the use of molded preforms, either molded separately or in situ. In this latter case, the preform is formed in the hot mold. With the preform undercured, the mold is opened and the foil circuit (the flexible circuit supported by still curable adhesive film) is inserted in registration...